SPB106-AP-1,708-0066,H&D Wireless SPB106-AP-1 WLAN 模块, SDIO, SPI总线接口, 2.7 → 3.6V, 支持802.11b/g协议 ,H&D Wireless
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H&D Wireless SPB106-AP-1 WLAN 模块, SDIO, SPI总线接口, 2.7 → 3.6V, 支持802.11b/g协议

制造商零件编号:
SPB106-AP-1
库存编号:
708-0066
H&D Wireless SPB106-AP-1
声明:图片仅供参考,请以实物为准!

SPB106-AP-1产品详细信息

Surface mount WiFi board

The SPB106 is an SMD module with the HDG104 WLAN System-In-Package and all peripheral components required. It is a complete solution designed to be surface mounted on any host system requiring 802.11b/g WiFi. It provides up to 54Mbit/s data rate when operating in the OFDM mode and up to 11Mbit/s data rate when operating in the DSSS/CCK mode. The host interface supports SPI communication when used with the 10-pin RF-header connection (WLESS), and SDIO when used in a custom board with the AVR32UC3A3. Software drivers and a complete application example are included in Atmel AVR32 UC3B Software Framework from release 1.5.0 onwards

Data Rates: 1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54Mbps
Modulation: QPSK, 16QAM, 64QAM DBPSK, DQPSK, CCK, OFDM with BPSK
WEP and AES hardware encryption accelerator up to 128 bits
Chip Antenna and connector for external antenna (optional) mounted on the board
Low power consumption due to efficient class AB PA design
UMA Compliant
Advanced power management for optimum power consumption at varying load
Bluetooth co-existence support
Power Supply: +3.3V from EVK board
Small footprint 25.8 x 20.6mm

SPB106-AP-1产品技术参数

  长度  25.8mm  
  电源电压  2.7 → 3.6V  
  宽度  20.6mm  
  支持的安全标准  AES, WEP  
  支持的协议  802.11b/g  
  支持的总线接口  SDIO, SPI  
  最低工作温度  -20°C  
  最高工作温度  +70°C  
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SPB106-AP-1产品技术参数资料

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