HF650P-0.001-01-00-54,752-4881,Bergquist Hi-Flow 650P 自粘 电子散热垫 HF650P-0.001-01-00-54, 1.5W/m·K, 0.001in厚 ,Bergquist
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Bergquist Hi-Flow 650P 自粘 电子散热垫 HF650P-0.001-01-00-54, 1.5W/m·K, 0.001in厚

制造商零件编号:
HF650P-0.001-01-00-54
库存编号:
752-4881
Bergquist HF650P-0.001-01-00-54
声明:图片仅供参考,请以实物为准!

HF650P-0.001-01-00-54产品详细信息

Hi-Flow 650P

Hi-Flow? 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow? 650P offers high temperature reliability ideal for automotive applications. Hi-Flow? 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

HF650P-0.001-01-00-54产品技术参数

  材料  Hi-Flow 650P  
  材料商品名称  Hi-Flow 650P  
  工作温度范围  -40 → +150 °C  
  厚度  0.001in  
  热传导率  1.5W/m·K  
  自粘  是  
  最低工作温度  -40°C  
  最高工作温度  +150°C  
关键词         
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QQ:800152669

HF650P-0.001-01-00-54产品技术参数资料

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